AMD Ryzen 3000 DDR4 Scaling – Part II – Samsung B-Die vs Micron E-Die vs Hynix CJR – English version
4 x 8GB Samsung B-Die
To see how the X570 platform works with 4 memory sticks, we used two identical GSkill SniperX kits, one of them being the original kit used in the first scaling test. Unfortunately, the daisy-chain topology is optimised for two memory sticks, and there was a great amount of stress applied to the memory controller, so we got significantly lower performance compared to using only 2 memory sticks. We were able to reach DDR4 4000 18-18-18-39, and the tightest timings we could use for DDR4 3800 1: 1 were 16-17-17-39 2T.